German 10-year bond yield fell 0.4 bps to 2.955%.

Guangzhou's 15th Five-Year Plan prioritizes breakthroughs in domestically produced AI compute chip adaptation and heterogeneous-compute dynamic scheduling and aims to build an autonomous, controllable intelligent-computing-center architecture. The plan directs accelerated development of vertical-sector large-model technologies and embodied intelligence—robot multimodal perception, bionic dexterous hands, autonomous learning and decision-making—and supports R&D and productization of intelligent sensors, EDA design and simulation tools, core materials, advanced processes and key equipment.

1. 三星開始向客戶交付首批12層HBM4E樣品。 2. 閃迪CTO：AI競賽正變成“拼內存”，HBF成套產品明年推出。 3. 阿里達摩院首次發佈GPU版本求解器，突破億級變量“不可解”難題。 4. 華爲推出星河AI數據中心網絡方案，Token生產效率提升2~5倍。 5. 歐盟計劃重啓《芯片法案》，需投入1200億歐元重振本土芯片產業。 6. 機構：2026年第一季度美國智能手機市場同比下滑3%。 7. Fadu贏得價值465億韓元的eSSD控制器供應合同。 8. 德明利推出其首款QLC UFS嵌入式存儲，號稱性能比肩TLC同類產品。 9. 摩根大通：存儲芯片股散戶買盤“持續且高漲”，毫無獲利了結跡象。