Amanda Ng, portfolio specialist at Pulaisi Group, said in a report the next phase of AI-related investment opportunities is more likely to sit further upstream in the supply chain rather than with headline AI platforms or chipmakers. She singled out advanced packaging, semiconductor substrates and high-end printed circuit boards (PCBs) as increasingly critical: although they account for a small share of AI bill-of-materials, they can become chokepoints. Ng added that modest price increases in th

Amanda Ng, portfolio specialist at Pulaisi Group, said in a report the next phase of AI-related investment opportunities is more likely to sit further upstream in the supply chain rather than with headline AI platforms or chipmakers. She singled out advanced packaging, semiconductor substrates and high-end printed circuit boards (PCBs) as increasingly critical: although they account for a small share of AI bill-of-materials, they can become chokepoints. Ng added that modest price increases in these components could materially boost manufacturers’ margins while remaining affordable for end customers.