Amanda Ng, portfolio specialist at Pulaisi Group, said in a report the next
phase of AI-related investment opportunities is more likely to sit further
upstream in the supply chain rather than with headline AI platforms or
chipmakers. She singled out advanced packaging, semiconductor substrates and
high-end printed circuit boards (PCBs) as increasingly critical: although they
account for a small share of AI bill-of-materials, they can become chokepoints.
Ng added that modest price increases in these components could materially boost
manufacturers’ margins while remaining affordable for end customers.
