Canada's prime minister Carney said Ottawa has named Germany's Thyssenkrupp Marine Systems (TKMS) as the preferred supplier for its next‑generation submarine fleet and will begin negotiations. The federal budget has earmarked an estimated cost for 12 submarines; the procurement is projected to raise Canadian defence spending to about 4% of GDP by 2030. Canada aims to sign a contract with the preferred bidder by end‑2027, with the first four submarines scheduled for early delivery in 2034. If neg

2026-07-07

Canada's prime minister Carney said Ottawa has named Germany's Thyssenkrupp Marine Systems (TKMS) as the preferred supplier for its next‑generation submarine fleet and will begin negotiations. The federal budget has earmarked an estimated cost for 12 submarines; the procurement is projected to raise Canadian defence spending to about 4% of GDP by 2030. Canada aims to sign a contract with the preferred bidder by end‑2027, with the first four submarines scheduled for early delivery in 2034. If negotiations with TKMS fail, Ottawa may open talks with South Korea's Hanwha Ocean. TKMS is a leading German naval shipbuilder and a core supplier in the global conventional‑submarine market.

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2026-07-07

JP Morgan Asset Management global markets strategist Raisah Rasid said robotics and autonomous-driving firms could be the next winners in AI-driven trades as large-scale adoption accelerates, particularly in generative AI. She said AI gains are spreading beyond hyperscalers and that earnings growth — especially in hardware — has been a key driver of major market returns. Rasid added KOSPI’s triple-digit 1H rally is unlikely to repeat in H2, with growth set to moderate as companies may struggle t

2026-07-06

Intel is internally evaluating a dual-sided power-delivery architecture using both wafer front- and back-side metallization for its 1.4nm-class process to help narrow the gap with foundry rivals. The company had planned an in-house back-side power-distribution network (BSPDN) called PowerDirect for the base 14A node; it is now assessing a hybrid front-and-back metal routing approach for 14A2. The shift is driven by lithography limits, notably random defects when shrinking the minimum metal-layer