蘋果(AAPL.O)CEO庫克：第三季度在大中華區的Mac銷售特別強勁。

國家發改委：近期正在會同有關部門抓緊研究制定擴大內需戰略實施方案。

The Information, citing two people familiar with the project, reports TSMC (TSM.N) is developing an advanced chip-packaging technology similar to Intel's (INTC.O) Embedded Multi-die Interconnect Bridge (EMIB). With AI driving demand to integrate more processors and high-bandwidth memory into larger multi-die packages, advanced packaging has emerged as a key industry bottleneck. Intel’s EMIB uses small silicon bridges to create high-speed links between processors and memory, enabling larger multi-chip AI designs and helping customers diversify supply chains; it has attracted interest from NVIDIA (NVDA.O). Sources say TSMC engineers internally call the work “EMIB-like” and have discussed the solution with some customers.