據俄新社：俄羅斯正採取措施，確保亞速海-黑海船舶航行安全及保護船隻，以應對無人機襲擊。

At end-July, Roundhill Memory ETF (DRAM) rebalanced and re-added A-share Changxin Technology with a 2.52% weight, making it the fund's eighth-largest holding. GigaDevice dropped to the 10th slot with a 1.51% weight after being first included in June at 2.91%. The ETF's current top-10 holdings include Samsung Electronics, Micron Technology, SK Hynix, Seagate Technology, Western Digital Corp, SanDisk, Kioxia, Changxin Technology, Nanya Technology and GigaDevice.

CITIC Securities research says advanced packaging will remain a primary path for sustaining steep performance upgrades in high-end chips. Glass substrates could relieve current advanced-packaging bottlenecks—larger panel sizes, higher-density/high-speed upgrades and output efficiency—and may be entering an accelerated maturity and volume ramp. The report notes clear penetration trends and high growth elasticity for glass carrier boards and flags industry-chain investment opportunities; glass interposers, glass carriers and glass bridges are also seen as significant growth areas.