MOFCOM said foreign firms have filed Section 337 investigation applications targeting certain rechargeable cylindrical cells, battery modules and products incorporating those modules.

U.S. Embassy in Lebanon said substantial technical work is required to ensure civilian safety.

CITIC Securities research says advanced packaging will remain a primary path for sustaining steep performance upgrades in high-end chips. Glass substrates could relieve current advanced-packaging bottlenecks—larger panel sizes, higher-density/high-speed upgrades and output efficiency—and may be entering an accelerated maturity and volume ramp. The report notes clear penetration trends and high growth elasticity for glass carrier boards and flags industry-chain investment opportunities; glass interposers, glass carriers and glass bridges are also seen as significant growth areas.