美國7月ISM製造業物價支付指數 71.1，預期71，前值73。

CITIC Securities research says advanced packaging will remain a primary path for sustaining steep performance upgrades in high-end chips. Glass substrates could relieve current advanced-packaging bottlenecks—larger panel sizes, higher-density/high-speed upgrades and output efficiency—and may be entering an accelerated maturity and volume ramp. The report notes clear penetration trends and high growth elasticity for glass carrier boards and flags industry-chain investment opportunities; glass interposers, glass carriers and glass bridges are also seen as significant growth areas.

UK Maritime Trade Operations said there are currently no reports of any vessels being damaged.