Eurozone July core CPI (final, MoM) 0.0%; prior 0.0%.

JCET said it has achieved a significant advance in high-aspect-ratio through-silicon via (TSV) technology and, with partners, completed sample fabrication. The TSV process targets 2.5D/3D advanced packaging, silicon interconnects and heterogeneous integration, intended to strengthen JCET’s microsystem integration process capabilities and provide one-stop manufacturing support for system-level integration of high-compute, high-memory chips.

Beijing time Aug 19 20:00 — White House: handle executive business; 23:00 — Oval Office: policy meeting; Beijing time Aug 20 00:30 — Oval Office: policy meeting; 02:30 — Roosevelt Room: remarks to tech industry leaders; 04:00 — Oval Office: policy meeting.