南向資金淨買額達10億元。

2026-08-24

南向資金淨買額達10億元。

其他消息
2026-08-24

At Hot Chips 2026, SK Hynix packaging engineering VP Jaesik Lee said the company will adopt advanced packaging—including Intel's EMIB—for next‑generation HBM and plans to transition to 3D packaging. SK Hynix is exploring hybrid bonding to overcome the 16‑layer stacking limit and intends to increase TSV counts, raise IO speeds through tighter logic‑process integration, and optimize power‑delivery networks to mitigate power and thermal challenges.

2026-08-24

New Zealand’s conservative coalition will submit a bill to parliament on Monday to ban social media use by under‑16s and to impose fines up to 10% of a platform’s global revenue for non‑compliance. The draft bill would require platforms to take reasonable steps to verify user age, including using existing account data, facial‑recognition technology and digital identity documents. Prime Minister Christopher Luxon said the measure responds to harms from harmful content, addictive design and pressu