法國總統馬克龍與到訪的沙特王儲穆罕默德·本·薩勒曼在巴黎出席協議簽署儀式。

US Vice President Vance said Canada has been the worst country on trade policy, accusing it of imposing absurd tariffs on states including Maine and warning the US will retaliate against unfair trade measures.

At Hot Chips 2026, SK Hynix packaging engineering VP Jaesik Lee said the company will adopt advanced packaging—including Intel's EMIB—for next‑generation HBM and plans to transition to 3D packaging. SK Hynix is exploring hybrid bonding to overcome the 16‑layer stacking limit and intends to increase TSV counts, raise IO speeds through tighter logic‑process integration, and optimize power‑delivery networks to mitigate power and thermal challenges.