CINNO•IC Research says investment in China’s PCB industry in H2 2026 will concentrate on high-end AI-compute PCBs, with increased R&D in high-end HDI, ultra-high multilayer boards and advanced packaging substrates to narrow international gaps and consolidate AI and automotive high-end PCB positions. Regional deployment will optimize: eastern regions to focus on high-end R&D while central and western regions absorb supporting manufacturing to improve coordination. Green manufacturing capex will a

CINNO•IC Research says investment in China’s PCB industry in H2 2026 will concentrate on high-end AI-compute PCBs, with increased R&D in high-end HDI, ultra-high multilayer boards and advanced packaging substrates to narrow international gaps and consolidate AI and automotive high-end PCB positions. Regional deployment will optimize: eastern regions to focus on high-end R&D while central and western regions absorb supporting manufacturing to improve coordination. Green manufacturing capex will accelerate, with faster deployment of environmentally friendly materials and energy-saving processes.