CINNO•IC Research says investment in China’s PCB industry in H2 2026 will
concentrate on high-end AI-compute PCBs, with increased R&D in high-end HDI,
ultra-high multilayer boards and advanced packaging substrates to narrow
international gaps and consolidate AI and automotive high-end PCB positions.
Regional deployment will optimize: eastern regions to focus on high-end R&D
while central and western regions absorb supporting manufacturing to improve
coordination. Green manufacturing capex will accelerate, with faster deployment
of environmentally friendly materials and energy-saving processes.