以色列總理內塔尼亞胡：如果伊朗選擇攻擊我們，他們知道這將是他們最後的決定之一。

Broadcom (AVGO.O) CEO said the company began shipping next-generation TPU v8i to Google (GOOG.O) this quarter.

TSMC has added next-generation microchannel cooling to its R&D roadmap, sources say. Market reports have previously linked NVIDIA to microchannel adoption but cited technical hurdles; with TSMC pushing the technology, microchannel cooling could gain wider industry uptake and NVIDIA may introduce it on its next-generation Feynman platform. TSMC says it will start investing in related R&D to support major customers as transistor counts and compute rise, noting single-chip power draw could reach or exceed 4,000W—levels at which conventional water-cooling plates may be insufficient. Chen Yanming, head of advanced packaging R&D at TSMC, said microchannel cooling embeds microfluidic channels inside the die or package to bring coolant closer to the heat source and improve heat-transfer efficiency.