TSMC has added next-generation microchannel cooling to its R&D roadmap, sources say. Market reports have previously linked NVIDIA to microchannel adoption but cited technical hurdles; with TSMC pushing the technology, microchannel cooling could gain wider industry uptake and NVIDIA may introduce it on its next-generation Feynman platform. TSMC says it will start investing in related R&D to support major customers as transistor counts and compute rise, noting single-chip power draw could reach or

TSMC has added next-generation microchannel cooling to its R&D roadmap, sources say. Market reports have previously linked NVIDIA to microchannel adoption but cited technical hurdles; with TSMC pushing the technology, microchannel cooling could gain wider industry uptake and NVIDIA may introduce it on its next-generation Feynman platform. TSMC says it will start investing in related R&D to support major customers as transistor counts and compute rise, noting single-chip power draw could reach or exceed 4,000W—levels at which conventional water-cooling plates may be insufficient. Chen Yanming, head of advanced packaging R&D at TSMC, said microchannel cooling embeds microfluidic channels inside the die or package to bring coolant closer to the heat source and improve heat-transfer efficiency.