TSMC has added next-generation microchannel cooling to its R&D roadmap, sources
say. Market reports have previously linked NVIDIA to microchannel adoption but
cited technical hurdles; with TSMC pushing the technology, microchannel cooling
could gain wider industry uptake and NVIDIA may introduce it on its
next-generation Feynman platform. TSMC says it will start investing in related
R&D to support major customers as transistor counts and compute rise, noting
single-chip power draw could reach or exceed 4,000W—levels at which conventional
water-cooling plates may be insufficient. Chen Yanming, head of advanced
packaging R&D at TSMC, said microchannel cooling embeds microfluidic channels
inside the die or package to bring coolant closer to the heat source and improve
heat-transfer efficiency.
