美國8月未季調能源通脹年率 16.3%，前值14.7%。

At Goldman Sachs' 2026 TMT conference, managements from TSMC, Amkor, SanDisk, Teradyne and Applied Materials said structural AI demand is driving capacity additions across wafers, advanced packaging, storage and test, with some customers' demand visibility extending to 2030. Applied Materials said customers now provide rolling eight-quarter demand forecasts and have given long-term commitments through 2030. TSMC said N3 wafer and CoWoS capacity remain tight; new fabs typically take 2–3 years to build and require a 1–2 year production ramp. Amkor is advancing its Arizona advanced-packaging Phase II project to add about 60,000 sqm of cleanroom. SanDisk said NAND supply tightness is likely to persist through 2027 and could extend into 2028.

因未按照規定開展客戶盡職調查等事項，中國人民銀行對東方財富證券股份有限公司處以警告，罰款74萬元。