Industry sources say Samsung plans to raise outsourced glass-carrier cleaning throughput for its HBM process to 50,000 pieces/month next year from 20,000/month this year and 10,000/month last year. Glass carriers are temporary, reusable supports mounted beneath DRAM wafers to prevent warping or cracking during etch and drilling; actual carrier use depends on feed methods and process yield. A 2.5x rise versus this year suggests Samsung's HBM4-series output could at least double next year. Samsung

Industry sources say Samsung plans to raise outsourced glass-carrier cleaning throughput for its HBM process to 50,000 pieces/month next year from 20,000/month this year and 10,000/month last year. Glass carriers are temporary, reusable supports mounted beneath DRAM wafers to prevent warping or cracking during etch and drilling; actual carrier use depends on feed methods and process yield. A 2.5x rise versus this year suggests Samsung's HBM4-series output could at least double next year. Samsung is preparing to expand capacity for HBM4 and HBM4E, both using 12+-layer high-stack architectures.