BOE A said its glass-based packaging substrate trial line is fully online, producing 24-layer substrates larger than 100×100 mm that have passed in-factory reliability tests. The firm is conducting post-chip-on electrical testing with substrates packaged with real CPU and GPU chips running in servers and has sent the 24-layer product to customers for validation. A mass-production investment decision will depend on customer order volumes and yield; the company targets meeting mass-production inve

BOE A said its glass-based packaging substrate trial line is fully online, producing 24-layer substrates larger than 100×100 mm that have passed in-factory reliability tests. The firm is conducting post-chip-on electrical testing with substrates packaged with real CPU and GPU chips running in servers and has sent the 24-layer product to customers for validation. A mass-production investment decision will depend on customer order volumes and yield; the company targets meeting mass-production investment conditions in Q1 or in 1H next year.