BOE A said its glass-based packaging substrate trial line is fully online,
producing 24-layer substrates larger than 100×100 mm that have passed in-factory
reliability tests. The firm is conducting post-chip-on electrical testing with
substrates packaged with real CPU and GPU chips running in servers and has sent
the 24-layer product to customers for validation. A mass-production investment
decision will depend on customer order volumes and yield; the company targets
meeting mass-production investment conditions in Q1 or in 1H next year.
