TSMC is targeting US advanced-packaging production in 1H2028 after
GlobalFoundries said it signed a $2bn manufacturing agreement to mass-produce
COWOS silicon interposers in the US in 1H2028. Amkor’s Arizona plant is also
slated to begin production in early 2028, aligning supply-chain timing. Industry
estimates TSMC’s first Arizona advanced-packaging fab could start operations as
early as 1H2028; market focus is on whether trial production will begin ahead of
commercial output.
