TSMC is targeting US advanced-packaging production in 1H2028 after GlobalFoundries said it signed a $2bn manufacturing agreement to mass-produce COWOS silicon interposers in the US in 1H2028. Amkor’s Arizona plant is also slated to begin production i

2026-10-12

TSMC is targeting US advanced-packaging production in 1H2028 after GlobalFoundries said it signed a $2bn manufacturing agreement to mass-produce COWOS silicon interposers in the US in 1H2028. Amkor’s Arizona plant is also slated to begin production in early 2028, aligning supply-chain timing. Industry estimates TSMC’s first Arizona advanced-packaging fab could start operations as early as 1H2028; market focus is on whether trial production will begin ahead of commercial output.