Samsung Electronics will use its second wafer fab in Tyler, Texas to produce base wafers for high-bandwidth memory (HBM) for AMD and NVIDIA, Maeil Business Newspaper reports. The plant is expected to break ground this month; its entire capacity is reportedly pre-booked, with the bulk of orders coming from AMD. The facility will use an advanced 2nm process, cover about 2.7 million sq ft (roughly 1.5x the size of Samsung’s first US fab, which has a Tesla contract). Equipment installation is slated

Samsung Electronics will use its second wafer fab in Tyler, Texas to produce base wafers for high-bandwidth memory (HBM) for AMD and NVIDIA, Maeil Business Newspaper reports. The plant is expected to break ground this month; its entire capacity is reportedly pre-booked, with the bulk of orders coming from AMD. The facility will use an advanced 2nm process, cover about 2.7 million sq ft (roughly 1.5x the size of Samsung’s first US fab, which has a Tesla contract). Equipment installation is slated to begin in February 2029, with volume production targeted in 2030.