1. SK Hynix: AI demand drives memory prices higher throughout the year; customer inventory only lasts 4 weeks.
2. SK Hynix Chairman pledges to increase AI memory chip production.
3. ASML reveals breakthrough in EUV light source technology, expected to increase chip production by 50% by 2030.
4. Micron Technology plans to invest $200 billion to overcome AI memory bottlenecks.
5. Microsoft develops glass capable of storing data for tens of thousands of years.
6. CINNO Research: Off-season coupled with high costs leads to a decline in mobile phone panel prices across the board in February.
7. Paving the way for HBM5 and HBM6, Korean and American semiconductor companies launch new wide-width hot-press bonding equipment.
8. DeepSeek-V4 large-scale model release imminent; institutional research reports predict it will effectively break down the "chip wall" and "memory wall."
9. Reports indicate Samsung Electronics samples LPDDR6X memory to Qualcomm, potentially for use in the AI250 system.
10. Nvidia and Meta announced a multi-year strategic partnership, with Meta to deploy millions of Nvidia chips.
11. Nvidia: Collaborating on the deployment of Nvidia VERA-CPU, with the potential for large-scale deployment in 2027.
