1. OpenAI releases patent for a chip with 20 HBM memory stacks. 2. CPU supply is "severely insufficient," and the supply chain says major international manufacturers are planning another price increase in Q3. 3. The storage "supercycle" enters the

2026-04-24

1. OpenAI releases patent for a chip with 20 HBM memory stacks. 2. CPU supply is "severely insufficient," and the supply chain says major international manufacturers are planning another price increase in Q3. 3. The storage "supercycle" enters the performance realization phase. 4. Memory prices surge, Samsung warns its mobile phone division faces its first annual loss. 5. TSMC will mass-produce 1.3nm semiconductors in 2029. 6. Construction begins on TSMC's Arizona chip packaging plant, planned for operation before 2029. 7. Reports indicate Intel's next-generation Z970 chipset will take over most of the market positioning of the current B860. 8. Superchip Electronics: Establishes stable partnerships with globally renowned hard drive manufacturers in the storage field. 9. my country's third-generation semiconductor power electronics market size is projected to grow by 28.6% by 2025.