1. SK Hynix unveils its temperature-controlled thermal management storage technology, "iHBM".
2. Samsung Electronics reportedly completes prototype development of 900-layer ultra-high stacking 3D NAND flash memory.
3. Kioxia plans to mass-produce its 10th-generation BiCS 3D NAND flash memory in 2027.
4. Fitch: Kioxia is well-positioned to withstand fluctuations in the memory chip industry.
5. Institutions: The combined revenue of the top five global NAND Flash brands increased by 83.7% quarter-on-quarter in Q1.
6. Wiwynn responds to AI hardware price increases and shortages: Memory is the most scarce, followed by MLCCs, PCBs, and power supplies.
7. Micron's Manassas wafer fab begins production of 1α process DDR4.
8. Nvidia significantly raises expectations for new product prices, marking a new stage in the industry's upstream and downstream competition.
9. Infineon leads the EU's Moore 4Power initiative, with 62 parties from 15 countries collaborating to develop next-generation power chips.
10. SmartSens and Unisoc jointly develop high-speed optical interconnects for MicroLEDs.
