1. Samsung Electronics' HBM5 details revealed; it may adopt copper-based HPB heat dissipation technology, with mass production expected in 2028.
2. MediaTek: Its next-generation chip will exclusively use Intel's EMIB-T packaging, with mass production expected in Q4 2027.
3. Arm CEO: Overall memory chip supply remains tight.
4. NVIDIA's Spectrum-X Ethernet silicon photonics technology is now in full-scale mass production, offering 5 times the network energy efficiency of traditional transceivers.
5. SK Hynix plans to double its wafer capacity within five years.
6. Institutions: The three major manufacturers will significantly raise HBM prices in 2027.
7. JPMorgan Chase: The "Big Seven" US stocks and the memory sector are expected to continue rising.
8. Rising memory prices drag down smartphone sales; UBI Research lowers its OLED material demand forecast for this year.
9. Institutions: Global OLED panel manufacturers' luminescent material procurement is expected to reach $2.54 billion this year.
10. Phison and Intel launch AI PC memory expansion technology.
11. SK Group Chairman Chey Tae-won meets with Nvidia CEO Jensen Huang.
