1. SK Group announced that its chairman met with the CEO of TSMC (TSM.N) on Wednesday to focus on strengthening cooperation in high-bandwidth memory (HBM) development and next-generation advanced packaging.
2. Shenzhen-made chips successfully trained a trillion-level AI model.
3. Due to the continued rise in DDR5 prices, many PC manufacturers are re-betting on DDR4.
4. IDC predicts a turbulent second half of the year for the global PC market: there is no quick fix, the core issue is memory shortage.
5. TSMC CEO C.C. Wei: In the coming years, the company will struggle to meet global chip supply demands.
6. Microsoft Surface Laptop Ultra detailed specifications released: debuts NVIDIA RTX Spark chip, weighs less than 2 kg.
7. BOE Technology Group: 8.6th generation OLED production lines will begin mass production in 2026.
8. Huawei Cloud released new Agentic AI products including the AICS Lingqu intelligent computing cluster.
9. Parallel Technology: Plans to purchase computing servers and memory for no more than RMB 81.6335 million.
