Lehman Optoelectronics: The company's MIP (MicroLED-in-Package) technology is mainly used for the packaging of LED display panels. It is not a wafer-level integration technology and cannot be used for semiconductor chip packaging.

2026-06-18

Lehman Optoelectronics: The company's MIP (MicroLED-in-Package) technology is mainly used for the packaging of LED display panels. It is not a wafer-level integration technology and cannot be used for semiconductor chip packaging.