The Korea Printed Circuit Board and Semiconductor Packaging Association (KPCA)
said Samsung and SK Hynix have pressed substrate suppliers in recent price talks
to cut prices, asking vendors to roll back the roughly 3%–4% average increase
agreed in Q1. The chipmakers cited easing raw‑material pressure — notably gold
and copper — that prompted the earlier hikes and said H2 pricing should revert
to pre‑hike levels.
