TrendForce said in a new AI server industry report that rapid iteration of AI chips led by NVIDIA, AMD and Google have pushed single-chip thermal design power (TDP) above 1 kW and driven cabinet-level power to hundreds of kW, making liquid cooling pr

2026-08-17

TrendForce said in a new AI server industry report that rapid iteration of AI chips led by NVIDIA, AMD and Google have pushed single-chip thermal design power (TDP) above 1 kW and driven cabinet-level power to hundreds of kW, making liquid cooling progressively standard for high-end AI infrastructure. TrendForce projects liquid-cooling penetration in AI chips will reach 53% in 2026 and approach 60% in 2027.