TrendForce data shows that the penetration rate of liquid cooling for AI servers is projected to rise from approximately 38% in 2025 to 53% in 2026, and further approach 60% in 2027. The main driver of this change is the wider adoption of liquid cooling solutions in next-generation AI platforms from NVIDIA, AMD, and Google.
As AI chip power consumption and rack density continue to increase, liquid cooling is rapidly spreading from an optional configuration for some high-power servers to a mainstream solution for AI infrastructure. The penetration rate exceeding 50% for the first time in 2026 signifies that incremental AI capital expenditures are beginning to extend further into heat dissipation, power, and data center infrastructure.
