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President Trump asked to be allowed to finish the job, saying we will together turn a two-year recovery into 250 years of leadership.

2026-09-10

President Trump asked to be allowed to finish the job, saying we will together turn a two-year recovery into 250 years of leadership.

Other News
2026-09-10

China's Shanghai Composite closed down 17.1 points (-0.43%) at 3,934.4 on Sept 10 (Thu); Shenzhen Composite fell 105.65 points (-0.77%) to 13,617.67; CSI 300 INDEX declined 24.21 points (-0.53%) to 4,548.39; ChiNext Index dropped 16.55 points (-0.49%

China's Shanghai Composite closed down 17.1 points (-0.43%) at 3,934.4 on Sept 10 (Thu); Shenzhen Composite fell 105.65 points (-0.77%) to 13,617.67; CSI 300 INDEX declined 24.21 points (-0.53%) to 4,548.39; ChiNext Index dropped 16.55 points (-0.49%) to 3,338.42; STAR 50 Index fell 10.84 points (-0.69%) to 1,569.22.
2026-09-10

1. Reports indicate Nvidia's Rubin Ultra chip may switch to 8-layer HBM. 2. The memory spot market is experiencing partial divergence; channel and industry memory prices have generally increased, while SSD prices in some sectors have fallen. 3. Tre

1. Reports indicate Nvidia's Rubin Ultra chip may switch to 8-layer HBM. 2. The memory spot market is experiencing partial divergence; channel and industry memory prices have generally increased, while SSD prices in some sectors have fallen. 3. TrendForce: TSMC's global foundry market share reached a record 72.5%. 4. OpenAI Korea's head: Confident in the continued AI-driven memory chip boom. 5. OpenAI announces deepened cooperation with Samsung Electronics to jointly develop next-generation chips. 6. SK Hynix reiterates: No decision has been made regarding the sale of its Chongqing factory equity. 7. Samsung Electro-Mechanics and LG Innotek test products in an attempt to enter Intel's EMIB-T supply chain. 8. Shenzhen Technology: Subsidiary plans to invest 1.85 billion yuan to expand high-end memory chip packaging and testing capacity. 9. Omdia: US PC shipments grew 1.0% year-on-year in Q2. 10. Biwin Storage: Wafer-level advanced packaging and testing projects are expected to contribute revenue from the end of 2026.
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