1. Reports indicate Nvidia's Rubin Ultra chip may switch to 8-layer HBM.
2. The memory spot market is experiencing partial divergence; channel and industry memory prices have generally increased, while SSD prices in some sectors have fallen.
3. TrendForce: TSMC's global foundry market share reached a record 72.5%.
4. OpenAI Korea's head: Confident in the continued AI-driven memory chip boom.
5. OpenAI announces deepened cooperation with Samsung Electronics to jointly develop next-generation chips.
6. SK Hynix reiterates: No decision has been made regarding the sale of its Chongqing factory equity.
7. Samsung Electro-Mechanics and LG Innotek test products in an attempt to enter Intel's EMIB-T supply chain.
8. Shenzhen Technology: Subsidiary plans to invest 1.85 billion yuan to expand high-end memory chip packaging and testing capacity.
9. Omdia: US PC shipments grew 1.0% year-on-year in Q2.
10. Biwin Storage: Wafer-level advanced packaging and testing projects are expected to contribute revenue from the end of 2026.
