The Ministry of Industry and Information Technology and CHINA STATE PLANNER
issued the 15th Five-Year Plan for electronic information manufacturing,
prioritizing core-component and product-form advances in consumer electronics,
PCs, VR and wearables. For high-end smartphones the plan targets breakthroughs
in core chips and high-end display devices and supports R&D of new-form products
and differentiated competition. For personal computers it calls for
breakthroughs in high-performance chips and development of motherboard
architecture design and high-density PCB integration technology. The plan
emphasizes wider adoption of flexible displays and advanced packaging to
accelerate product-form innovation. For virtual reality it prioritizes near-eye
displays, multimodal sensing and interaction, spatial-intelligence technologies,
low-power application-specific chips, high-performance microdisplays and optical
components, and multi-form terminals. For wearables it seeks breakthroughs in
low-power processors, precision sensors, flexible electronic components and
substrate-like PCBs, plus lightweight operating systems to broaden supply of
watches, bands and rings.
