Hua Microelectronics said at its Oct. 13, 2026 interim results briefing that its
eight‑inch wafer line is expanding on schedule and is running at full production
and sales with high capacity utilization. Silicon carbide (SiC) PM modules are
still in development; SiC IPM modules have entered small‑volume sales. Over the
next five years the company will prioritize power semiconductors and related
industries, targeting IGBT, MOSFET, diode and wide‑bandgap product lines and
accelerating construction of chip and packaging production lines.
