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European semiconductor shares fell 2-6% after the CEO of ANTHROPIC urged AI companies to slow model development.
2026-09-14
European semiconductor shares fell 2-6% after the CEO of ANTHROPIC urged AI companies to slow model development.
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2026-09-14
Luzhou Laojiao said at an investor event that since H2 last year it has tightened linkage between channel quotas and bottle-opening volume, implementing “sales-based allocation, quota-linked activation” controls. Channel inventories have steadily fallen; with bottle-opening sales improving and last H2’s rolling base being digested, inventories will revert to healthy levels.
Luzhou Laojiao said at an investor event that since H2 last year it has tightened linkage between channel quotas and bottle-opening volume, implementing “sales-based allocation, quota-linked activation” controls. Channel inventories have steadily fallen; with bottle-opening sales improving and last H2’s rolling base being digested, inventories will revert to healthy levels.
2026-09-14
Xinqi Microelectronics said at its 2026 interim results meeting that H2 deliveries of high-end PCB equipment remain full and advanced packaging tools have moved into validation and deployment. The company expects next year's AI-server builds, related substrates and advanced packaging capacity expansions to drive additional equipment demand. Its Phase-II plant ramped in 1H with high capacity utilization and is expected to reach full release in H2; modular production and pre‑stocking of key compon
Xinqi Microelectronics said at its 2026 interim results meeting that H2 deliveries of high-end PCB equipment remain full and advanced packaging tools have moved into validation and deployment. The company expects next year's AI-server builds, related substrates and advanced packaging capacity expansions to drive additional equipment demand. Its Phase-II plant ramped in 1H with high capacity utilization and is expected to reach full release in H2; modular production and pre‑stocking of key components will support continued fulfillment of high-end PCB and advanced packaging equipment orders.
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