1. Ministry of Industry and Information Technology: Accelerate breakthroughs in key technologies such as training chips and heterogeneous computing power.
2. Some memory chip manufacturers have already discussed supply plans up to 2030.
3. Biwin Memory: The company expects its wafer-level advanced packaging and testing manufacturing project to reach a monthly capacity of 5,000 wafers by the end of 2026.
4. Jensen Huang: AI is essentially an architecture composed of a "five-layer cake," with layers including energy and chips.
5. GigaDevice announced the launch of its new generation GD32H7 series MCUs.
6. Demingli: The memory chip market is recovering, with net profit expected to increase by up to 128% in 2025.
7. Zhongtian Decoration: Its investee company HBM2e has entered mass production, and HBM3/3e is progressing through tape-out.
8. Samsung is using a 2nm process to design HBM logic chips.
9. Reports indicate that Samsung Electronics has discussed supply matters with equipment manufacturer ASMPT to diversify its supply chain for key high-bandwidth memory (HBM) equipment.
10. A Fudan University team has developed a "fiber chip" that is expected to provide key support for future industries such as brain-computer interfaces.
