SK Group said its chairman met with the CEO of TSMC (TSM.N) on Wednesday to focus on strengthening cooperation in the development of high-bandwidth memory (HBM) and next-generation advanced packaging.
2026-06-04
SK Group said its chairman met with the CEO of TSMC (TSM.N) on Wednesday to focus on strengthening cooperation in the development of high-bandwidth memory (HBM) and next-generation advanced packaging.