1. SK Hynix will begin mass production of 375-layer NAND flash memory by the end of the year; the use of molybdenum instead of tungsten is expected to boost performance.
2. Several equipment suppliers for SK Hynix have requested price increases.
3. According to Nikkei: SK Hynix plans to triple its wafer production capacity by 2034 to meet the growing demand for memory chips.
4. Institutional report: PC discrete graphics card shipments reached 11.82 million units in Q1, a year-on-year increase of 28.3%.
5. Google is reportedly in talks with Samsung to jointly develop next-generation chips.
6. Orders from TSMC have surged; Amkor is considering investing 1 trillion won to expand its Gwangju plant in South Korea.
7. Ming-Chi Kuo: CoPoS will begin mass production in the second half of 2028; glass and ABF are not substitutes.
8. The most powerful Arm CPU has officially launched, featuring 192 cores at 3nm.
9. Omdia: Semiconductor market revenue exceeded $300 billion in the first quarter.
10. SEMI: Global semiconductor equipment sales reached a record high of $36.5 billion in Q1, a 14% year-on-year increase.
11. Dinglong Technology: Received nearly 1,000 gallons of new orders for ArF and KrF photoresist products, which are essential consumables for logic and memory chip manufacturing.
