On June 15, Rongda Photosensitive stated on its interactive platform that, as of now, the company has not been involved in the research and development or production of chip bottom filler adhesive products, nor does it have any related plans.

2026-06-15

On June 15, Rongda Photosensitive stated on its interactive platform that, as of now, the company has not been involved in the research and development or production of chip bottom filler adhesive products, nor does it have any related plans.

Other News
2026-06-15

The combined turnover of the Shanghai and Shenzhen stock exchanges exceeded 3 trillion yuan for the second consecutive trading day.

2026-06-16

Key Economic Data and Events to Watch Today: Tuesday, June 16, 2026 ① TBD: China Academy of Information and Communications Technology (CAICT) launches Token Service Capability Climbing Plan ② TBD: Bank of Japan announces interest rate decision ③ 0