The semiconductor sector remains hot, but capital is shifting from a broad "chip narrative" to "pricing of more specific segments of the industry chain." Companies like Tongfu Microelectronics and JCET Group, specializing in packaging and testing, saw net inflows, while those in the memory or chip design chains, such as GigaDevice, Huatian Technology, Beijing Junzheng, Biwin Storage, Puran Technology, and Demingli, experienced significant outflows.
This indicates that capital is not indiscriminately chasing semiconductors, but rather is shifting within the sector. Packaging and testing, and advanced packaging, are more aligned with expectations of AI computing power expansion and domestic substitution, making them more likely to be seen as segments with greater certainty in the industry chain. Meanwhile, the memory and consumer electronics chains, which have already seen substantial gains and whose price cycles and demand recovery remain volatile, are more likely to see capital realize gains.