1. NVIDIA launches next-generation high-bandwidth memory technology, NVIDIA NVHBM, which provides higher memory performance and efficiency for XPUs.
2. Reports indicate that Changxin Memory has begun trial production of HBM3E memory, with mass production expected within weeks.
3. An industry report forecasts that the year-on-year decline in global smartphone panel shipments will narrow to 2.5% in 2026.
4. Samsung is developing 8-layer HBM4E for NVIDIA.
5. Samsung Electro-Mechanics wins a 1 trillion won order to supply multilayer ceramic capacitors (MLCCs) to major global companies.
6. TrendForce: The average spot price of DDR5 16Gb (2Gx8) 4800/5600 fell by 0.03% compared to the previous day.
7. SK Hynix responds to reports of "considering outsourcing HBM memory base die manufacturing to Intel": Some content is untrue.
8. Junzheng Shares: DRAM prices continued to rise in the third quarter due to strong demand and tight supply; price increases are expected to continue in the fourth quarter.
9. G.Skill launches Flare X5X series DDR5 memory, supporting AMD EXPO-ULL technology.
10. Synology launches the RS11626xs+, a petabyte-scale storage solution expandable up to 118 drive bays.
