At Goldman Sachs' 2026 TMT Conference, executives from companies such as TSMC, Amkor, SanDisk, Teradyne, and Applied Materials emphasized that the structural demand driven by AI is fueling capacity expansion in wafer fabrication, advanced packaging, memory, and testing, with some customers' demand visibility extending into 2030. Applied Materials stated that customers are currently providing rolling demand forecasts for eight quarters and have made long-term commitments extending to 2030.
TSMC indicated that N3 wafer and CoWoS capacity continues to be in short supply, and building new wafer fabs typically takes two to three years, with ramping up production taking another one to two years. Amkor is advancing its Arizona Advanced Packaging Phase 2 project, planning to add 60,000 square meters of cleanroom space; SanDisk expects the tight NAND supply and demand situation to continue until 2027, and possibly even into 2028.
