Samsung's first wafer fab (Fab 1) in Taylor, Texas, is progressing with equipment installation, factory and product verification, and is scheduled to begin operations by the end of 2026 and achieve commercial mass production in 2027. It will primarily use extreme ultraviolet (EUV) lithography technology to produce 2-nanometer chips. Meanwhile, Samsung Electronics plans to begin construction on its second wafer fab (Taylor Fab 2) in Taylor, Texas, in November 2026, aiming for mass production by 2030. This fab will have a planned area of approximately 2.7 million square feet (approximately 251,000 square meters), and the specific manufacturing process to be used has not yet been announced.
It is understood that the expansion is mainly driven by the demand for AI and high-performance computing. In July 2025, Samsung signed a $16.5 billion chip manufacturing agreement with Tesla, extending the contract to 2033, involving Tesla's next-generation AI6 chip, but the specific capacity allocation between the two fabs has not yet been disclosed. (Korea DIGITIMES)