1. SK Hynix accelerates the deployment of iHBM technology, with the next-generation HBM offering a 30% improvement in heat dissipation.
2. Nvidia (NVDA.O) announced plans to increase its packaging substrate production capacity to 2.5 times its current level within the next three years.
3. Nvidia launches the DSX POD AI factory, accelerating infrastructure deployment in Europe.
4. Nvidia launches the DGX Spark 64GB version, with two clusters supporting models with up to 200 billion parameters.
5. Goldman Sachs: Nvidia's physics AI revenue exceeds the full-year target, giving it a $300 price target.
6. Micron believes there is no feasible expansion path for 4F² DRAM memory; 1ε will use wafer bonding, and ζÅ will use HighNAEUV.
7. Reports indicate that Groq is planning to apply 3D stacked DRAM packaging technology to its next-generation chips.
8. Samsung foundry: 4nm capacity fully utilized, 5nm expansion underway, 2nm negotiations lagging. 9. Amazon spent billions to "lock in" Nvidia GPUs, but its warehouses are idle due to power shortages.
10. SK Hynix completed a 40 trillion won share buyback program.
